Amaoe PM 1 BGA Reballing Stencil – Precision for Qualcomm Power ICs

Elevate your mobile repair operations with the Amaoe PM 1 BGA Reballing Stencil, tailor-made for a wide array of Qualcomm Power Management ICs (PM-series). Designed to deliver ultra-precise solder ball placement with minimal hassle, this stencil is a must-have for professional microsoldering and BGA reballing tasks.

Key Features

Model-Specific Compatibility: Built exclusively for Qualcomm PM-series Power ICs, ensuring perfect alignment and superb reballing accuracy.

High-Grade Material: Crafted from durable, heat-resistant stainless steel (approx. 0.12 mm thickness), engineered to resist warping under repeated use.

Square Aperture Design: Features precise square-shaped holes that enhance solder ball control and adhesion for clean reflow.

Efficient & Reusable: Easy to use, compatible with hot-air rework stations, and reusable—perfect for high-volume or repeated reballing scenarios.

Supported Qualcomm PM-Series ICs

The Amaoe PM 1 stencil supports a range of PM-series chips, including—but not limited to—the following models:

PM8018

PM8926

PM8996

PM18996

PM8956

PM8941

PM8058

PM8916

PM8922

PM8921

PM8917

PM8953

PM8841

PM8909

PM8110

PM8004

PM8019

PM820EAD

Why Choose Amaoe PM 1?

Model-Focused Precision: Supports an extensive list of Qualcomm PM ICs—ensuring fast, accurate placement every time.

Robust Build: Made to endure sustained thermal cycles and repeated micro-reballing operations.

Enhanced Workflow: Delivers consistency and reliability—minimizing soldering defects, bridging, and rework.