Amaoe MQ:3 BGA Reballing Stencil – Precision for Snapdragon 865 and Next-Gen MTK/Qualcomm CPUs

Upgrade your micro-soldering toolkit with the Amaoe MQ:3 BGA Reballing Stencil, designed for high-density BGA chipsets including Snapdragon 865 (SM8250) and advanced MediaTek variants. Crafted for reliability and accuracy, this stencil ensures clean solder ball placement for professional motherboard repairs.

Key Features

Deformation-Resistant Build: Made from rigid material to retain form and alignment over repeated reballing sessions .

High-Precision Apertures: Combines square and round hole patterns that align perfectly with chip pad layouts .

Optimal Thickness: At 0.12 mm, the stencil balances durability and flexibility for smooth solder ball application .

Supported Chip Models

The MQ:3 stencil is tailored for select Qualcomm and MediaTek chipsets, including:

Qualcomm Snapdragon 865 / SM8250 – CPU and RAM layouts supported

Snapdragon variants: SM7150, SM6125, SM7250

MediaTek Dimensity: MT6885Z (both CPU and RAM pads) .

Why Amaoe MQ:3 Stands Out

Model-Specific Accuracy: Crafted to match the pad layout of Snapdragon 865 and MT6885Z precisely.

High Durability: Designed for repeated use without losing structural integrity.

Easy Application: Compatible with standard rework stations and supports clean, reliable solder ball placement.