Amaoe MQ:1 BGA Reballing Stencil – Targeted for Heritage Qualcomm & MediaTek CPUs

Upgrade your mobile repair toolkit with the Amaoe MQ:1 BGA Reballing Stencil, purpose-designed for accurate reballing of trusted Qualcomm and MediaTek chipsets. With precision-engineered apertures and durable construction, this stencil ensures efficient work with minimal errors for legacy mobile processors.

Key Features

Laser-Cut Precision: Offers precise square-round hole patterns for exact solder ball alignment and placement .

Durable Material: Constructed from deformation-resistant stainless steel with about 0.12 mm thickness, maintaining structural integrity through repeated use .

Multi-Chip Support: Covers a wide range of mid-tier smartphone chipsets, making it ideal for common repair tasks.

Cost-Effective Choice: Often priced around $1.99–$2.00, delivering excellent value for precision rework tools .

Supported Chip Models

The Amaoe MQ:1 stencil supports the following chipsets:

Qualcomm Snapdragon Series:

SDM845 (A & B variants)

SDM710

SDM660

MediaTek CPUs:

MT6771V (Helio P60/P70)

MT6739V

MT6757V (Helio P20)

MT6763V (Helio P23) .

Why Choose Amaoe MQ:1?

Model-Specific Precision: Designed specifically for the exact pad layouts of Snapdragon 845/710/660 and MediaTek Helio P/AP-series CPUs.

Reliable & Durable: Thick, high-quality steel withstands thermal cycles in hot-air rework without losing shape.

Quick & Efficient: Enhances workflow with accurate alignment—reducing solder bridging and rework needs.

SEO-Ready Copy: Includes high-impact keywords like Amaoe MQ:1, Snapdragon 845 stencil, MT6771V reballing, and 0.12 mm steel BGA stencil for better search visibility.