Amaoe MQ:2 BGA Reballing Stencil – Built for Mid-Range Qualcomm & MediaTek CPUs

Equip yourself with the Amaoe MQ:2 BGA Reballing Stencil, a high-precision tool thoughtfully crafted for reballing a variety of mid-tier Qualcomm and MediaTek processors. Known for its durability and accuracy, this stencil is ideal for repair professionals and DIY technicians working on common mobile CPUs and RAM configurations.

Key Features

High-Quality Material: Constructed from Japanese steel, delivering a super-hard and deformation-resistant performance. Thickness: approximately 0.12 mm.

Precision Apertures: Laser-cut square-pattern holes offer perfect alignment for solder ball placement, ensuring clean and consistent results.

Reusable & Durable: Built for long-term use, compatible with hot-air rework equipment—ideal for repeat reballing workflows.

Supported Chip Models

The Amaoe MQ:2 stencil supports the following chipsets:

Qualcomm:

MSM8909W (CPU & RAM)

SDM439

MediaTek (MTK):

MT6761V

MT6779V

MT6758V

MT6765V

MT6768V

Why Choose Amaoe MQ:2?

Exact Fit for Popular Models: Supports widely-used mid-range chipsets—perfect for frequent mobile motherboard repairs.

Reliable Construction: Its rigid, high-grade material ensures stencil integrity across frequent thermal cycles.

Enhanced Workflow: Guarantees alignment precision and minimal errors for clean reballing.