Amaoe MQ:5 BGA Reballing Stencil – Ultimate Precision for Latest Qualcomm & MTK CPUs

Take your mobile motherboard reballing to the next level with the Amaoe MQ:5 BGA Reballing Stencil, meticulously engineered for high-density Qualcomm and MediaTek CPU rework. This single stencil is designed to streamline reballing of advanced chipsets like MT6895Z, SM8475, SM8550, and more, offering pinpoint accuracy and professional-grade durability.

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Key Highlights

Premium Material: Crafted from Japanese steel, this stencil is super-hard and deformation-resistant—ensuring precise alignment every time.

Optimal Thickness: At 0.12 mm, it balances flexibility and rigidity for smooth solder paste or ball application.

Square Aperture Design: Promotes controlled solder ball placement and clean reflow results.

Reusable & Efficient: Compatible with hot-air rework stations; built for repeated use without loss of precision.

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Supported Chip Models on MQ:5

This stencil is specifically tailored for precision work on modern mobile CPUs. The MQ:5 stencil supports these high-end chip models:

MT6895Z, MT8795Z, MT6983Z, MT8176V

SM8475, SM6225, SM7450, SM8550

RAM496 (likely refers to BGA layout configuration)

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Why Choose Amaoe MQ:5?

Tailored Accuracy for the latest generation of MTK and Qualcomm CPUs.

Durable & Reliable due to its super-hard Japanese steel construction.

High Success Rates—engineered to deliver clean solder ball placement with minimal rework.