Amaoe MU:1 BGA Reballing Stencil – Precision for Mid-Tier MTK & Snapdragon CPUs

Upgrade your reballing toolkit with the Amaoe MU:1 BGA Reballing Stencil, engineered for precision and built to last. Crafted from deformation-resistant materials and featuring a perfect square/round aperture design, this stencil ensures accurate solder ball placement for trusted mobile chipsets.

Key Features

Deformation-Resistant Steel: Made from durable Japanese-grade or stainless steel with 0.12 mm thickness, resistant to warping even under hot-air rework.

Accurate Aperture Design: Combines square and round holes for optimal alignment of pitch pads.

Reusable & Cost-Efficient: Affordable (around $1.99) and engineered for multiple reballing cycles.

Laser-Cut Precision: Ensures alignment with exact chip pad configurations.

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Supported Chip Models

The MU:1 stencil is specifically tailored for the following chipsets:

MediaTek CPUs:

MT6795W (Helio X10)

MT6797W (Helio X20)

MT6595

MT6732

MT6750

Qualcomm CPUs:

Snapdragon SDM845 A & B

Snapdragon SDM710

Snapdragon SDM660

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Why Amaoe MU:1 Excels

Model-Specific Accuracy: Ensures perfect pad alignment for each supported chipset.

High Durability: Robust material and design withstand frequent thermal cycles and usage.

Precision Workflow: Supports clean, reliable solder application—minimizing bridging and rework.