Amaoe MU:4 V2.0 BGA Reballing Stencil – High-Precision for Mid-to-High MTK Processors

Upgrade your mobile device repair workflow with the Amaoe MU:4 V2.0 BGA Reballing Stencil, designed to deliver exceptional accuracy and durability for a wide range of MediaTek CPU and RAM packages. Perfect for reballing tasks on modern devices like Samsung A-series smartphones—a must-have for pros and hobbyists alike.

Key Features

Premium Material: Constructed from super-hard Japanese stainless steel at 0.12 mm thickness, ensuring longevity and resistance to bending or deformation.

Square & Round Apertures: Precisely laser-cut holes ensure accurate solder ball alignment and clean reballing outcomes.

Reusable & Sturdy: Designed for repeated use in hot-air rework stations without compromising performance or shape.

Version 2.0 Improvements: While specifics on “V2.0” updates aren’t detailed in the sources, it generally indicates enhanced manufacturing precision or updated hole layouts compared to the original MU:4 model.

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Supported Chip Models

The MU:4 V2.0 Stencil is tailored for reballing both CPU and RAM for the following MediaTek chipsets:

MT6885Z (Dimensity series)

MT6853V (e.g., Galaxy A32 chipset)

MT6769V

MT6779V

MT6891Z (both CPU & RAM configurations)

MT6758V

MT6768V

These align with mid-to-high tier mobile chipsets commonly found in modern smartphone models.

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Why Amaoe MU:4 V2.0 Stands Out

Dedicated Precision: Ensures perfect pad alignment for complex chip designs like MT6885Z and MT6891Z.

Robust Performance: Built from durable steel with consistent aperture quality—ideal for frequent reballing jobs.

Enhanced Workflow: Promotes efficient, error-free solder ball placement, cutting down rework and improving success rates.