Amaoe SAM:1 BGA Reballing Stencil – Precision for Samsung S8, S8+, and Note8 CPUs

Elevate your mobile motherboard repair workflow with the Amaoe SAM:1 BGA Reballing Stencil, engineered specifically for the Samsung Galaxy S8, S8+, and Note8. Designed for the highest standard of MSM8998 / Exynos 8895 CPU reballing, this tool ensures unmatched precision and consistency—every time.

Key Highlights

Tailored compatibility: Ideal for Samsung Galaxy S8 / S8+ / Note8 with MSM8998 / Exynos 8895 CPUs.

Stainless Steel Build: Durable, heat-resistant, and maintains shape under continuous use.

Ultra-fine 0.12mm Mesh: Enables flawless solder ball alignment and placement.

Effortless Workflow: Compatible with standard hot-air reflow stations; ensures high success rates in reballing with exceptional precision.

Ideal for Professionals: Essential for mobile repair technicians and industry-grade reballing operations across repair shops and service centers.

Supported Models & Chipsets

This stencil works universally across the following Samsung models and chipsets:

Samsung Models: Galaxy S8, S8+, Note8 (Samsung model codes G9500, G955U, N9500)

Chipsets: MSM8998 and Exynos 8895.

Why Choose Amaoe SAM:1?

Model-specific Accuracy: Guarantees perfect pad alignment for Galaxy S8/S8+/Note8 CPUs.

Robust Performance: Crafted from high-quality materials to endure frequent use.

Fast & Reliable Reballing: Consistent, clean solder application—minimizing errors and rework.

SEO-Boosted Description: Includes key search terms like Amaoe SAM:1, Samsung S8 reballing stencil, Exynos 8895 CPU reballing, and MSM8998 BGA stencil to enhance discoverability.