Mechanic / Welsolo VS04 Universal BGA Reballing Stencil – Multi-Size Precision for Mobile BGA Chips

Upgrade your BGA reballing arsenal with the Mechanic (Welsolo) VS-04 Universal Stencil, a versatile and durable tool made for efficient solder ball placement across a wide variety of mobile device BGA chips.

Key Features

Multi-Size Mesh Compatibility: Includes apertures in 0.3 mm, 0.35 mm, 0.4 mm, and 0.5 mm—ideal for diverse BGA chip sizes and pin densities.

Robust Construction: Crafted from deformation-resistant steel, this stencil ensures long-lasting performance and consistent accuracy under repeated use.

Precision Alignment: Engineered with square and round hole designs for clean solder ball application and optimal pad alignment.

Wide Operating Range: Rated for temperatures from -50 °C to 500 °C, making it safe for hot-air rework and standard BGA reballing setups.

Universal Utility: Marketed as a “universal stencil”, it’s built to handle multiple BGA chip layouts across mobile devices, though individual stencil may not be model-specific.

Specifications at a Glance

Attribute Details

Sizes Supported 0.3 mm / 0.35 mm / 0.4 mm / 0.5 mm
Material Steel (Deformation-resistant)
Aperture Types Square & Round for precision
Temperature Range -50 °C to 500 °C
Compatibility Universal — fits various mobile BGA chips
Package Includes 1 × VS-04 Universal BGA Reballing Stencil

Why Choose the VS-04 Stencil?

Versatility: With multiple mesh sizes in one stencil, it suits numerous BGA chip types, reducing the need for multiple single-use stencils.

Durability: Steel construction and high heat tolerance make it reliable for repeated reballing tasks.

Precision First: Its mix of aperture shapes ensures accurate solder ball placement, reducing bridging and rework.

Smart Choice for Tec-Shops: Ideal for technicians servicing varying chip formats across different models, especially in mobile phone repair labs.